FGM842D is a series of cutting-edge MCU Wi-Fi and Bluetooth modules launched by Quectel. It boasts a high-performance processor (ARM968) with a frequency of up to 160MHz and supports IEEE 802.11b/g/n protocol and BLE 5.2. The module features built-in 288KB RAM and 2MB flash, ensuring efficient performance.
The module is in an LGA form factor with an ultra-compact package size, which optimizes the size and cost for end-products and is compatible with diverse designs.
The module complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards, supports TRNG (True Random Number Generator) and AES-128 encryption algorithm, and supports secure firmware and flash encryption.
The module supports UART and GPIO interfaces by default and supports SPI, I2C, ADC and PWM functions in QuecOpen® solution and many low power consumption modes and keep-alive mechanisms, which provide flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios.
The module supports QuecOpen® solution and standard AT commands, with a compact protocol, and can realize efficient product development for customers.
Wi-Fi 4 module, single band (2.4GHz) Wi-Fi, 1 × 1 antenna
Bluetooth Low Energy (BLE 5.2)
Built-in 288KB RAM and 2MB flash
Supports IEEE 802.11b/g/n
Supports up to 19 GPIOs for SPI, I2C, ADC and PWM interfaces in QuecOpen® solution
RF coaxial connector, pin antenna interface, PCB antenna (optional)
Wide operating temperature range
Wi-Fi 4 single-band and BLE 5.2 module
LGA form factor
FGM842D: 12.5mm × 13.2mm × 1.8mm
FGM842D-P: 16.6mm × 13.2mm × 1.8mm
FGM842D: 1.05g
FGM842D-P: 1.14g
Operating temperature range: -40℃ to +105℃
Storage temperature range: -45℃ to +115℃
